电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2011年
12期
4-7
,共4页
金锡共晶%芯片烧结%空隙率%密封%可靠性
金錫共晶%芯片燒結%空隙率%密封%可靠性
금석공정%심편소결%공극솔%밀봉%가고성
Au-Sn eutectic solder%die sintering%air-tightness%hermetic%reliability
文章论述了金锡共晶烧结工艺在功率器件焊接中的应用，分析了金锡共晶烧结温度、时间和压力对芯片粘接质量的影响。同时分析了金锡焊料重熔后粘接层孔隙的变化，试验表明金锡共晶烧结时控制好烧结工艺参数，可以保证多次重熔对粘接层孔隙率的影响，粘接质量能满足相关要求。
文章論述瞭金錫共晶燒結工藝在功率器件銲接中的應用，分析瞭金錫共晶燒結溫度、時間和壓力對芯片粘接質量的影響。同時分析瞭金錫銲料重鎔後粘接層孔隙的變化，試驗錶明金錫共晶燒結時控製好燒結工藝參數，可以保證多次重鎔對粘接層孔隙率的影響，粘接質量能滿足相關要求。
문장논술료금석공정소결공예재공솔기건한접중적응용，분석료금석공정소결온도、시간화압력대심편점접질량적영향。동시분석료금석한료중용후점접층공극적변화，시험표명금석공정소결시공제호소결공예삼수，가이보증다차중용대점접층공극솔적영향，점접질량능만족상관요구。
In this paper, Au/Sn eutectic sintering technology on the power device packaging application was discussed. The influence of temperature, time and force on Au/Sn sintering were tested in die attach experiments. After Au/Sn sintering to die, Au/Sn sintering to sealing has also been analyzed in the packaging. The result suggests that controlling the sintering parameters will improve the quality of the adhesive layer air- tightness after re-melting. Air tightness and yield rate ofAu/Sn eutectic could be controlled and the packaging reliability will satisfy the need of packaging technology.
