CAJ | 학술논문

通过正交试验得到了化学镀铜速率适中而稳定性极高的化学镀铜工艺；采用PdCl2加速分解实验研究了多元络合剂化学镀铜液的稳定性。结果表明：使用多元络合剂时存在交互作用可大大延长镀液的分解时间，同时使镀液的全面分解转变为少量颗粒上的缓慢分解。稳定剂的加入主要是抑制Cu+的生长，同时也降低了金属铜的生成速率。
통과정교시험득도료화학도동속솔괄중이은정성겁고적화학도동공예；채용PdCl2가속분해실험연구료다원락합제화학도동액적은정성。결과표명：사용다원락합제시존재교호작용가대대연장도액적분해시간，동시사도액적전면분해전변위소량과립상적완만분해。은정제적가입주요시억제Cu+적생장，동시야강저료금속동적생성속솔。
The technique of electroless copper deposition on printed circuit boards (PCB)with high stability and moderate rate is obtained by orthogonal experimenting and stability of multicomplexing electroless copper deposition is studied by adding PdCl2 in solution.The results show that decomposing time of solution can be much prolonged and the overall decomposing of solution is transformed into slow and partial decomposing on few grains when using multicomplexing.Stabilizer plays a role in restraining Cu+ and Cu0 from producing.