印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
7期
49-55
,共7页
高速板材%互连应力失效%高密度互联
高速闆材%互連應力失效%高密度互聯
고속판재%호련응력실효%고밀도호련
High Speed Material%Interconnect Defect(ICD)%High Density Interconnect(HDI)
通过分析初步确定了影响高速系统HDI互连应力失效的因素为次外层铜厚、钻孔参数、等离子去钻污时间以及化学除胶参数等。采用正交试验的方法，发现孔壁去钻污不净是引起内层互连应力失效的主要原因。等离子去钻污时间越长，发生互连应力失效的概率越低；次外层铜厚、钻孔参数、等离子去钻污时间和除胶方式组合分别采用53.9μm、高速材料参数、15 min和不过膨胀时，内层互连合格率为100%，当采用最好或最差参数均会引起互连应力失效。
通過分析初步確定瞭影響高速繫統HDI互連應力失效的因素為次外層銅厚、鑽孔參數、等離子去鑽汙時間以及化學除膠參數等。採用正交試驗的方法，髮現孔壁去鑽汙不淨是引起內層互連應力失效的主要原因。等離子去鑽汙時間越長，髮生互連應力失效的概率越低；次外層銅厚、鑽孔參數、等離子去鑽汙時間和除膠方式組閤分彆採用53.9μm、高速材料參數、15 min和不過膨脹時，內層互連閤格率為100%，噹採用最好或最差參數均會引起互連應力失效。
통과분석초보학정료영향고속계통HDI호련응력실효적인소위차외층동후、찬공삼수、등리자거찬오시간이급화학제효삼수등。채용정교시험적방법，발현공벽거찬오불정시인기내층호련응력실효적주요원인。등리자거찬오시간월장，발생호련응력실효적개솔월저；차외층동후、찬공삼수、등리자거찬오시간화제효방식조합분별채용53.9μm、고속재료삼수、15 min화불과팽창시，내층호련합격솔위100%，당채용최호혹최차삼수균회인기호련응력실효。
Thickness of first inner layer foil, drilling condition, Plasma treating time and desmear, the main factors of high speed HDI board interconnect defect, were defined by basic analysis. The results of an orthogonal experiment showed that, smear of the hole wall is the main reason of interconnect defect. Increasing Plasma treating time can reduce the probability of interconnect defect. The thickness of first inner layer foil is 53.9μm, B drilling condition, Plasma treated 15 minutes, chemical desmear without swelling lead to none interconnect defect, but the best and the worst conditions both can increase the probability of interconnect defect.
