CAJ | 학술논문

在Sn-Zn系无铅焊料的基础上,通过添加合金元素Al和P制备出不同成分的无铅焊料,研究了其无铅焊料的物理性能.结果表明:通过加入适量合金元素Al和P的Sn-Zn-Al-P系无铅焊料在基本上不影焊料响熔点的前提下,可以减小密度,降低成本,提高其导电性能和润湿性.
재Sn-Zn계무연한료적기출상,통과첨가합금원소Al화P제비출불동성분적무연한료,연구료기무연한료적물이성능.결과표명:통과가입괄량합금원소Al화P적Sn-Zn-Al-P계무연한료재기본상불영한료향용점적전제하,가이감소밀도,강저성본,제고기도전성능화윤습성.
The different weight percentages of Sn-Zn-Al-P lead-flee solders were processed by adding alloying elements Al and P. The physical properties of Sn-Zn-Al-P lead-free solders were researched. The results show that appropriate amount of alloying elements Al and P of Sn-Zn-Al-P lead-free solders can reduce the density to cut the costs and improve conductive property and wetting ability without the effect of melting point of Sn-Zn-Al-P lead-free solders.