电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2010年
2期
40-42,46
,共4页
殷立涛%任凤章%马战红%苏娟华%田保红%贾淑果
慇立濤%任鳳章%馬戰紅%囌娟華%田保紅%賈淑果
은립도%임봉장%마전홍%소연화%전보홍%가숙과
铜%镍%薄膜%直流电沉积%原位弯曲阴极法%内应力
銅%鎳%薄膜%直流電沉積%原位彎麯陰極法%內應力
동%얼%박막%직류전침적%원위만곡음겁법%내응력
copper%nickel%thin film%direct-current electro-deposition%in-situ bent-cathode method%intemal stress
利用直流电沉积法,在碳素钢和铜基体上沉积Ni膜,以及在碳素钢基体上沉积Cu膜.用自行设计的原位弯曲阴极测量装置,测量了不同基体上不同薄膜的内应力.实验表明,原位弯曲阴极法比普通悬臂梁法更精确、简便.薄膜材料的内应力与基体材料有关.碳素钢基体和纯铜基体上沉积的Ni膜内应力随膜厚呈相反的变化趋势.碳素钢基体上电沉积Cu膜的内应力随膜厚的增加而降低;而碳素钢基体上电沉积Ni膜的内应力随膜厚的增加而增大,但当膜厚增大到一定程度时,内应力变化平缓.
利用直流電沉積法,在碳素鋼和銅基體上沉積Ni膜,以及在碳素鋼基體上沉積Cu膜.用自行設計的原位彎麯陰極測量裝置,測量瞭不同基體上不同薄膜的內應力.實驗錶明,原位彎麯陰極法比普通懸臂樑法更精確、簡便.薄膜材料的內應力與基體材料有關.碳素鋼基體和純銅基體上沉積的Ni膜內應力隨膜厚呈相反的變化趨勢.碳素鋼基體上電沉積Cu膜的內應力隨膜厚的增加而降低;而碳素鋼基體上電沉積Ni膜的內應力隨膜厚的增加而增大,但噹膜厚增大到一定程度時,內應力變化平緩.
이용직류전침적법,재탄소강화동기체상침적Ni막,이급재탄소강기체상침적Cu막.용자행설계적원위만곡음겁측량장치,측량료불동기체상불동박막적내응력.실험표명,원위만곡음겁법비보통현비량법경정학、간편.박막재료적내응력여기체재료유관.탄소강기체화순동기체상침적적Ni막내응력수막후정상반적변화추세.탄소강기체상전침적Cu막적내응력수막후적증가이강저;이탄소강기체상전침적Ni막적내응력수막후적증가이증대,단당막후증대도일정정도시,내응력변화평완.
Ni films were deposited on carbon steel and copper substrates and Cu films were prepared on carbon steel substrates by using direct-current electrodeposition method. The internal stress in the films was measured by using a self-designed in-situ bent-cathode measuring instrument. The results showed that the in-situ bent-cathode method is more accurate and simple than that of general cantilever method. The intemal stress is related to the matrix materials. The intemal stress in Ni films on carbon steel shows the opposite trend to that on copper substrates. The internal stress in Cu films on carbon steel is decreased with increasing thickness while that in Ni films on carbon steel is increased with increasing thickness; however, it doesn't change significantly when the film thickness increases to a certain extent.