CAJ | 학술논문

　　主要通过对印制电路板层压的研究，探讨一些单层多张PP结构的PCB板，在压合后产生大量流胶及芯板局部变形后导致钻孔孔偏等问题的影响因素。包括对PCB板的结构设计、半固化片的裁切尺寸、压合前的排板方式、压板过程的升温速率及半固化片的凝胶时间等影响因素的对比试验，统计各可能因素的不良率。结果表明：半固化片的凝胶时间是影响流胶大及局部孔偏的主要因素。
　　주요통과대인제전로판층압적연구，탐토일사단층다장PP결구적PCB판，재압합후산생대량류효급심판국부변형후도치찬공공편등문제적영향인소。포괄대PCB판적결구설계、반고화편적재절척촌、압합전적배판방식、압판과정적승온속솔급반고화편적응효시간등영향인소적대비시험，통계각가능인소적불량솔。결과표명：반고화편적응효시간시영향류효대급국부공편적주요인소。
In this paper, by research on the printed circuit board laminates, explore some of the single-layer structure of the PCB multiple PP laminated to produce abnormal flow of plastic and inner layer core local deformation problems which leads to the drill holes partial abnormal factor. This includes the structural design of the PCB Prepreg cutting size of a row board before lamination, the heating rate of the pressure plate process and prepreg gel time comparison test of the influence factors, statistical defect rate of possible factors. The results show that:the prepreg gel time is the main factors affecting the flow of plastic large and localized holes.