CAJ | 학술논문

为克服大尺寸显示面板中反应时间的延迟问题,采用低阻栅线是十分有益的,同样在小尺寸面板上也存在这种相互匹配的过程.然而,由于Al较高的氧化速度,铝合金和ITO材料接触性能并不太好.文章介绍了在室温ITO沉积过程中,通过增加ACX (Al-C-Ni)中Ni含量来减少ACX-ITO接触电阻.经室温ITO沉积后,接触电阻成功地减少到300 Ω,而且没有ACX引起的问题出现.
위극복대척촌현시면판중반응시간적연지문제,채용저조책선시십분유익적,동양재소척촌면판상야존재저충상호필배적과정.연이,유우Al교고적양화속도,려합금화ITO재료접촉성능병불태호.문장개소료재실온ITO침적과정중,통과증가ACX (Al-C-Ni)중Ni함량래감소ACX-ITO접촉전조.경실온ITO침적후,접촉전조성공지감소도300 Ω,이차몰유ACX인기적문제출현.
Low resistivity of gate line is very useful for large size panel by overcoming RC delay, also, for small size application with fine pitch process. However, Al-based alloy is not easily contact to ITO metal because of high oxidation rate. This study focused to reducing ACX-ITO contact resistance by increasing nickel composition and room temperature ITO deposition process. By the room temperature ITO deposition process, contact resistance was successfully reduced about 300 Ω and no ACX originated problem was occurred.