CAJ | 학술논문

为了防止陶瓷壳体中的电路和底部的热敏感微器件的高温损坏,应用高频感应局部加热技术实现陶瓷壳体气密封装.5 s内.焊料环和可伐盖板上的涡电流产生的热量使温度升高至约320℃,由于热传导.此时陶瓷壳体的底部区域温度约100℃.采用红外热像仪、氯质谱检测仪、六轴测试仪和三维显微镜,分别对陶瓷封装过程中的局部温度变化、温度分布、气密性、封装强度和封装断面进行了检测和分析.结果表明,感应局部加热的效果良好.封装的陶瓷壳体有较好气密性;封装壳体的拉伸强度从4.0 MPa到16.0 MPa,与封装压力和感应加热时间相关;断面的分析表明过长的加热时间导致焊料的外溢.
위료방지도자각체중적전로화저부적열민감미기건적고온손배,응용고빈감응국부가열기술실현도자각체기밀봉장.5 s내.한료배화가벌개판상적와전유산생적열량사온도승고지약320℃,유우열전도.차시도자각체적저부구역온도약100℃.채용홍외열상의、록질보검측의、륙축측시의화삼유현미경,분별대도자봉장과정중적국부온도변화、온도분포、기밀성、봉장강도화봉장단면진행료검측화분석.결과표명,감응국부가열적효과량호.봉장적도자각체유교호기밀성;봉장각체적랍신강도종4.0 MPa도16.0 MPa,여봉장압력화감응가열시간상관;단면적분석표명과장적가열시간도치한료적외일.
In order to protect the circuit in package and the thermal-sensitive devices at the bottom of the ceramic crust from high-temperature damage, high frequency localized induction heating technology was applied to packaging the ceramic crust. It took only about 5 s to complete the packaging process. The temperatures on the cover edges near the solder-loop and at the bottom of the ceramic package were about 320 ℃ and 100 ℃, respectively. The local temperature variation, temperature distribution, hermetic test, tensile strength and fracture analysis in this packaging process were tested and evaluated by infrared thermal imager, helium mass spectrometry detector, six-axis tester and three-dimensional microscope. Results show that due to the solder reflow, hermetic seal of the ceramic package is accomplished. La addition, a tensile strength in the range of 4.0 Mpa-16.0 Mpa is achieved,which depends on the induction heating time and packaging pressure. Finally, longer heating time will lead to the overflow of the solder.