CAJ | 학술논문

在半导体材料的加工过程中,晶片的精确定位应用于多个工序,一方面能提高生产率,另一方面也能提高产品的一致性,保证晶片的加工精度。目前的定位方式分为两种,仅对电子定位系统加以介绍,针对不同的晶片轮廓采用不同的识别数据,介绍了数据采集原理和数据特点,以及轮廓识别软件如何对数据进行分析和处理,最终实现对晶片的精确定位。
재반도체재료적가공과정중,정편적정학정위응용우다개공서,일방면능제고생산솔,령일방면야능제고산품적일치성,보증정편적가공정도。목전적정위방식분위량충,부대전자정위계통가이개소,침대불동적정편륜곽채용불동적식별수거,개소료수거채집원리화수거특점,이급륜곽식별연건여하대수거진행분석화처리,최종실현대정편적정학정위。
During the semiconductor material processing,the wafer accurate positioning is used in many process.Because it can enhance the productivity and,on the other hand,it can improve product consistency to ensure the wafer process precision.The current position can be divided into two types.The electronic positioning system,one of the two types,is introduced in this paper,which deals different wafer profile with different identification data.Furthermore,the principles of data acquisition and data characteristics are described.The profile identification software is used to analysis and process the data,which ultimately achieve the precise positioning purpose.