CAJ | 학술논문

从前处理、升华温度、裂解温度、沉积压力、基体温度和膜层厚度等方面讨论了Parylene处理技术在国内外高频电路防护方面的应用概况。重点介绍了这些工艺要素与Parylene膜层性能的相关性,并指出了膜层厚度及均匀度是影响高频电路防护的关键因素,膜层厚度需要通过试验进行确定,简要论述了Parylene膜层的沉积机理与Parylene处理技术在毫米波电路防护上应用的工艺流程。同时指出了Parylene处理技术在高频电路防护应用中存在的不足之处,为以后的研究指明了方向。
종전처리、승화온도、렬해온도、침적압력、기체온도화막층후도등방면토론료Parylene처리기술재국내외고빈전로방호방면적응용개황。중점개소료저사공예요소여Parylene막층성능적상관성,병지출료막층후도급균균도시영향고빈전로방호적관건인소,막층후도수요통과시험진행학정,간요논술료Parylene막층적침적궤리여Parylene처리기술재호미파전로방호상응용적공예류정。동시지출료Parylene처리기술재고빈전로방호응용중존재적불족지처,위이후적연구지명료방향。
Discuss the application of Parylene in High Frequency Circuit as a protect-ion layer,including preparation process,sublimation temperature,pyrolysis temperature,deposition pressure,base temperature and the film thickness.The relativity of process elements and film is introduced.Put forward film thickness and uniform are the key factors of high frequency protection.The film thickness could determine by the experiment.Expound the mechanism of Parylene deposition and the process flow in millimeter-wave circuit.Finally,the shortage of Parylene used in high frequency circuit and the new research points was proposed.