电化学
電化學
전화학
2006年
1期
1-8
,共8页
硅%侵刻%溶解%表面结构%器件加工%表面反应%微机电系统
硅%侵刻%溶解%錶麵結構%器件加工%錶麵反應%微機電繫統
규%침각%용해%표면결구%기건가공%표면반응%미궤전계통
Silicon%Etching%Dissolution%Surface structure%Micro device fabrication%Surface reactions%MEMS
从原子水平到微米尺寸,准确控制硅表面结构的精密加工,诸如无序的表面粗糙或者精细的图案,乃是电子元件性能及其可靠性的保证.硅在液中的湿清洗以及硅表面侵刻的电化学反应对硅表面结构的形成具有重要作用.近数十年来,有关阐明和控制硅/溶液界面上复杂的电化学反应及其与表面结构形成的关系已有大量的研究,相关研究成果已在新近编著成书.本文综合有关方面研究资料评述现代硅溶解及其形成的表面结构.
從原子水平到微米呎吋,準確控製硅錶麵結構的精密加工,諸如無序的錶麵粗糙或者精細的圖案,迺是電子元件性能及其可靠性的保證.硅在液中的濕清洗以及硅錶麵侵刻的電化學反應對硅錶麵結構的形成具有重要作用.近數十年來,有關闡明和控製硅/溶液界麵上複雜的電化學反應及其與錶麵結構形成的關繫已有大量的研究,相關研究成果已在新近編著成書.本文綜閤有關方麵研究資料評述現代硅溶解及其形成的錶麵結構.
종원자수평도미미척촌,준학공제규표면결구적정밀가공,제여무서적표면조조혹자정세적도안,내시전자원건성능급기가고성적보증.규재액중적습청세이급규표면침각적전화학반응대규표면결구적형성구유중요작용.근수십년래,유관천명화공제규/용액계면상복잡적전화학반응급기여표면결구형성적관계이유대량적연구,상관연구성과이재신근편저성서.본문종합유관방면연구자료평술현대규용해급기형성적표면결구.
Accurate control and fabrication of silicon surface structures from atomic scale to micrometer scale,which may be randomly associated with surface roughness or have well defined patterns, is critical for the performance and reliability of electronic devices. Electrochemical reactions of silicon in solutions involved in wet cleaning and etching of silicon wafer play an important role in determining the structures of silicon surface. A tremendous amount of researches have been done in the last several decades to understand and control a range of complex electrochemical reactions at silicon/solution interface and their relations to the resulted surface structures. The findings generated from these research efforts have been compiled and integrated in a recently published book. This paper is to present an overview, using synthesized information from this book, on the aspect of silicon dissolution and the resulted surface structures.
