CAJ | 학술논문

微热管是高热流密度光电芯片领域广泛应用的高效热传导元件,抽真空和灌注是其性能的重要影响工序.通过分析目前微热管制造工艺中常用的抽真空灌注技术,提出灌注抽真空微热管制造技术;分析该技术的工作原理和二次除气理论,建立工质额外充液量、微热管工作死区、二次除气集气段长度等数学模型;对比分析抽真空灌注与灌注抽真空两种制造技术的特点;搭建微热管性能测试平台,对采用灌注抽真空技术制造的铜一水沟槽式微热管进行性能测试;对比研究引入额外充液量前后,灌注抽真空技术制造的微热管传热性能的差异,发现引入额外充液量后,微热管性能提高了12倍.试验结果表明灌注抽真空技术可以很好地满足微热管的制造需求.
미열관시고열류밀도광전심편영역엄범응용적고효열전도원건,추진공화관주시기성능적중요영향공서.통과분석목전미열관제조공예중상용적추진공관주기술,제출관주추진공미열관제조기술;분석해기술적공작원리화이차제기이론,건립공질액외충액량、미열관공작사구、이차제기집기단장도등수학모형;대비분석추진공관주여관주추진공량충제조기술적특점;탑건미열관성능측시평태,대채용관주추진공기술제조적동일수구조식미열관진행성능측시;대비연구인입액외충액량전후,관주추진공기술제조적미열관전열성능적차이,발현인입액외충액량후,미열관성능제고료12배.시험결과표명관주추진공기술가이흔호지만족미열관적제조수구.
Micro heat pipe is an apparams with high effective heat transfer efficiency for complementary metal oxide semiconductor (CMOS)chips which have high heat flux in a limited space,and its manufacturing technology ofvacuuming and filling working fluid is critical for its quality.The conventional micro heat pipe manufacturing technology of first vacuuming then filling working fluid (FVFW)is analyzed,the manufacturing technology of first filling working fluid then v acuuming(FWFV)is proposed.The principle of the technology and the theory for second vacuuming are analyzed.Furthermore,Mathematical models are established,including the additional liquid inventory,the volume of work dead zone and the length of non-condensable gas.Comparison between FWFV and FVFW is investigated.Some copper-water grooved-wick micro heat pipes which are bficmed by FWFV are tested to validate FWFV. It shows that the performance of the micro heat pipe with additional liquid inventory improves 12 times that of without additional liquid inventory.Therefore.the micro heat pipe manufacturing technology of FWFV call manufacture micro heat pipes successfully.