CAJ | 학술논문

圆片制造技术的不断提升有效缓解了单位芯片的成本压力,同样功能的芯片尺寸越来越小,封装工艺也迫切面临提升的要求,尤其是小芯片极易在塑封工序产生背面针孔等方面的问题,这对塑封工艺提出了新的挑战。文中针对小芯片在塑封工艺中产生针孔的原理进行了深入分析,重点通过一系列试验改善针孔发生的比例,其中框架载片台打凹深度对针孔发生有重要影响,最终通过调整和优化载片台打凹深度值,有效解决了小芯片封装过程中容易产生塑封体背面针孔的问题,从而稳定了塑封的生产效率、产品合格率等。
원편제조기술적불단제승유효완해료단위심편적성본압력,동양공능적심편척촌월래월소,봉장공예야박절면림제승적요구,우기시소심편겁역재소봉공서산생배면침공등방면적문제,저대소봉공예제출료신적도전。문중침대소심편재소봉공예중산생침공적원리진행료심입분석,중점통과일계렬시험개선침공발생적비례,기중광가재편태타요심도대침공발생유중요영향,최종통과조정화우화재편태타요심도치,유효해결료소심편봉장과정중용역산생소봉체배면침공적문제,종이은정료소봉적생산효솔、산품합격솔등。
The continuous improvement of the wafer technology effectively relieves the cost pressure of unit die.The die size with a homogeneous function becomes more and more small and the assembly technology is facing an urgent requirement for improvement.Especially on the backside pinhole issue of the small dies at molding process,which puts forward the new challenge to the molding technology.A deep analysis in this article elaborates the principle on the pinhole issue at molding process;mainly reduce the pinhole occurrence with a lot of evaluations and find that the downset of the die pad has a significant influence on the pinhole.A final solution with downset adjusting and improvement effectively resolve the backside pinhole issue on small dies so that to ensure the production efficiency at molding process and the yield.