材料导报
材料導報
재료도보
MATERIALS REVIEW
2009年
z2期
206-209
,共4页
引线键合%铜丝球焊%IC封装%可靠性测试
引線鍵閤%銅絲毬銲%IC封裝%可靠性測試
인선건합%동사구한%IC봉장%가고성측시
wire bonding%copper ball bonding%IC packaging%reliability testing
铜线具有优良的机械、电、热性能,用其代替金线可以缩小焊接间距、提高芯片频率和可靠性.介绍了引线键合工艺的概念、基本形式和工艺参数;针对铜丝易氧化的特性指出,焊接时必须采用特殊的防氧化工艺,以改善其焊接性能;最后对铜丝键合可靠性及主要失效模式进行了分析.
銅線具有優良的機械、電、熱性能,用其代替金線可以縮小銲接間距、提高芯片頻率和可靠性.介紹瞭引線鍵閤工藝的概唸、基本形式和工藝參數;針對銅絲易氧化的特性指齣,銲接時必鬚採用特殊的防氧化工藝,以改善其銲接性能;最後對銅絲鍵閤可靠性及主要失效模式進行瞭分析.
동선구유우량적궤계、전、열성능,용기대체금선가이축소한접간거、제고심편빈솔화가고성.개소료인선건합공예적개념、기본형식화공예삼수;침대동사역양화적특성지출,한접시필수채용특수적방양화공예,이개선기한접성능;최후대동사건합가고성급주요실효모식진행료분석.
The copper wire has a good mechanical, electrical and thermal properity. Instead of gold wire, it can be used in wire bonding to shorten the spacing of bonding,and to enhance frequency and reliability of chip. The research on concept of wire bonding process, the basic form and process parameters are reviewed in this paper. Aiming at oxidation characteristics of copper wire, the special anti-oxidation process, which can improve its welding performance must be used in welding. Finally, reliability and some main failure mechanisms of copper wire bonding are analyzed.
