半导体技术
半導體技術
반도체기술
SEMICONDUCTOR TECHNOLOGY
2010年
3期
237-240
,共4页
赵义坤%王华%耿凯鸽%唐娟
趙義坤%王華%耿凱鴿%唐娟
조의곤%왕화%경개합%당연
键合%内引线%欧姆接触%热压焊接%超声波焊接热%超声键合
鍵閤%內引線%歐姆接觸%熱壓銲接%超聲波銲接熱%超聲鍵閤
건합%내인선%구모접촉%열압한접%초성파한접열%초성건합
bonding%inner down-lead%ohmic contact%heat presure welding%ultrasonic welding%ultrasonic wedge bonds
现阶段Au丝作为内引线一直占着键合的主导地位,由于Cu丝具有优良的电性能和价格优势,随着键合技术的发展,以Cu丝代替Au丝作为键合用内引线已经成为必然,封装行业许多厂家正热衷于将原有的Au丝键合设备进行改造,但还存在这样那样的问题.以Au丝键合改为Cu丝键合的技术研究为出发点,首先介绍了键合技术的发展,然后通过工艺调整和设备改造,使得Cu丝作为内引线能够代替Au丝在该设备上使用,同时达到了节约生产成本,节约资金的目的.对改造过程中的气体流量、压力、功率、焊接时间等参数问题进行了详细地阐述,同时对芯片、键合劈刀等也做了相应调整,使得改造后的检测结果完全满足产品要求.大力推进以Cu丝替代Au丝键合技术,可节约生产成本,提高键合强度,增强导电率、导热率等,具有重要的经济技术效益,必将迎来封装业的又一次大变革.
現階段Au絲作為內引線一直佔著鍵閤的主導地位,由于Cu絲具有優良的電性能和價格優勢,隨著鍵閤技術的髮展,以Cu絲代替Au絲作為鍵閤用內引線已經成為必然,封裝行業許多廠傢正熱衷于將原有的Au絲鍵閤設備進行改造,但還存在這樣那樣的問題.以Au絲鍵閤改為Cu絲鍵閤的技術研究為齣髮點,首先介紹瞭鍵閤技術的髮展,然後通過工藝調整和設備改造,使得Cu絲作為內引線能夠代替Au絲在該設備上使用,同時達到瞭節約生產成本,節約資金的目的.對改造過程中的氣體流量、壓力、功率、銲接時間等參數問題進行瞭詳細地闡述,同時對芯片、鍵閤劈刀等也做瞭相應調整,使得改造後的檢測結果完全滿足產品要求.大力推進以Cu絲替代Au絲鍵閤技術,可節約生產成本,提高鍵閤彊度,增彊導電率、導熱率等,具有重要的經濟技術效益,必將迎來封裝業的又一次大變革.
현계단Au사작위내인선일직점착건합적주도지위,유우Cu사구유우량적전성능화개격우세,수착건합기술적발전,이Cu사대체Au사작위건합용내인선이경성위필연,봉장행업허다엄가정열충우장원유적Au사건합설비진행개조,단환존재저양나양적문제.이Au사건합개위Cu사건합적기술연구위출발점,수선개소료건합기술적발전,연후통과공예조정화설비개조,사득Cu사작위내인선능구대체Au사재해설비상사용,동시체도료절약생산성본,절약자금적목적.대개조과정중적기체류량、압력、공솔、한접시간등삼수문제진행료상세지천술,동시대심편、건합벽도등야주료상응조정,사득개조후적검측결과완전만족산품요구.대력추진이Cu사체대Au사건합기술,가절약생산성본,제고건합강도,증강도전솔、도열솔등,구유중요적경제기술효익,필장영래봉장업적우일차대변혁.
At present, though the spun gold as the inner down-lead is in the highest flight, with the development of bonding technology, the use of brass wires instead of the spun gold as the inner down-lead is the direction, because the brass wires has good electric conductivity and low price. In packaging industry, many manufacturers are keen on the renovation of the original equipment to reduce the production cost, although the new bonding technology has lots of problems. This text based on the technology research of using brass wire bonding instead of the spun gold bonding,it introduced the development of bonding technology first, and then adjusted the technics and renovated the equipment, so as to realize the brass wires instead of the spun gold as the inner down-lead on the equipment to save production costs. It is taking the gas flow, pressure, power, welding time and other parameters in the process of renovation into account, and adjusting the chip, chopper and other things to make the renovated test result fully satisfy the product requirements. So, greatly promoting the brass wires instead of the spun gold bonding will bring us many benefits, such as, saving production costs, improving bonding strength, enhancing the electrical conductivity and thermal conductivity. These economic and technological benefits will bring a great change in the packaging industry.