河北大学学报(自然科学版)
河北大學學報(自然科學版)
하북대학학보(자연과학판)
JOURNAL OF HEBEI UNIVERSITY(NATURAL SCIENCE EDITION)
2010年
1期
37-42,48
,共7页
庞秀言%苏亚娟%吕溥%任海丽%巩菲
龐秀言%囌亞娟%呂溥%任海麗%鞏菲
방수언%소아연%려부%임해려%공비
膨胀石墨%二苯胺-4-磺酸盐%吸附动力学%吸附热力学
膨脹石墨%二苯胺-4-磺痠鹽%吸附動力學%吸附熱力學
팽창석묵%이분알-4-광산염%흡부동역학%흡부열역학
expanded graphite%diphenylamine-4-sulfonate%adsorption kinetics%adsorption thermodynamics
以二苯胺-4-磺酸钠(DPASA)为吸附质,研究了其在膨胀石墨(EG)上的吸附动力学及热力学行为;针对DPASA的初始质量浓度,温度,pH值,离子强度以及EG的膨胀容积(EV)对吸附性能的影响进行了讨论.吸附动力学研究表明此过程可用准二级模型描述;在测试DPASA质量浓度及温度下,吸附过程活化能为1~10 kJ/mol.吸附热力学研究显示DPASA在EG上的吸附属于Ⅱ型;平衡吸附量随DPASA初始质量浓度、溶液离子强度和EG的EV的增加而增大;温度和pH值对吸附性能没有显著影响;物理吸附是吸附过程中的主导因素.
以二苯胺-4-磺痠鈉(DPASA)為吸附質,研究瞭其在膨脹石墨(EG)上的吸附動力學及熱力學行為;針對DPASA的初始質量濃度,溫度,pH值,離子彊度以及EG的膨脹容積(EV)對吸附性能的影響進行瞭討論.吸附動力學研究錶明此過程可用準二級模型描述;在測試DPASA質量濃度及溫度下,吸附過程活化能為1~10 kJ/mol.吸附熱力學研究顯示DPASA在EG上的吸附屬于Ⅱ型;平衡吸附量隨DPASA初始質量濃度、溶液離子彊度和EG的EV的增加而增大;溫度和pH值對吸附性能沒有顯著影響;物理吸附是吸附過程中的主導因素.
이이분알-4-광산납(DPASA)위흡부질,연구료기재팽창석묵(EG)상적흡부동역학급열역학행위;침대DPASA적초시질량농도,온도,pH치,리자강도이급EG적팽창용적(EV)대흡부성능적영향진행료토론.흡부동역학연구표명차과정가용준이급모형묘술;재측시DPASA질량농도급온도하,흡부과정활화능위1~10 kJ/mol.흡부열역학연구현시DPASA재EG상적흡부속우Ⅱ형;평형흡부량수DPASA초시질량농도、용액리자강도화EG적EV적증가이증대;온도화pH치대흡부성능몰유현저영향;물리흡부시흡부과정중적주도인소.
With diphenylamine -4- sulfonic acid sodium (DPASA) as referenced compound, its adsorption kinetics and thermodynamics characteristics on expanded graphite (EG) were investigated. The influence of initial mass concentrations of DPASA, temperatures, pH, ionic strengths and adsorbent expanded volumes (EV) on the adsorption capacity was studied. Kinetic studies show that the kinetic data are well described by the pseudo second-order kinetic model. Under the tested condition, the activation energy of adsorption process is among 1-10 kJ/mol. The adsorption thermodynamics results indicate that the adsorption types of DPASA on EG is type II. Equilibrium adsorption amount was found to increase with the increase in initial mass concentrations of DPASA, ionic strengths and EV of the adsorbent, while temperature and solution acidity do not have an obvious effect. Physical adsorption is the major factor of the overall adsorption process.