CAJ | 학술논문

基于铜的随动强化模型,使用三维有限元方法,分析在窄-宽线铜互连结构中添加伪通孔对互连应力诱生空洞的影响.对宽互连M1分别为无伪通孔、中间添加伪通孔、右侧边沿添加伪通孔和添加双伪通孔结构进行了研究.结果表明,添加伪通孔不但可以降低通孔底部互连M1区域的空洞生长速率,而且使伪通孔正下面的互连M1成为额外的空位收集器,从而有效地提高互连应力诱生空洞性能,双伪通孔可进一步增强应力诱生空洞性能.
기우동적수동강화모형,사용삼유유한원방법,분석재착-관선동호련결구중첨가위통공대호련응력유생공동적영향.대관호련M1분별위무위통공、중간첨가위통공、우측변연첨가위통공화첨가쌍위통공결구진행료연구.결과표명,첨가위통공불단가이강저통공저부호련M1구역적공동생장속솔,이차사위통공정하면적호련M1성위액외적공위수집기,종이유효지제고호련응력유생공동성능,쌍위통공가진일보증강응력유생공동성능.
Based on copper kinematic hardening model, effect of dummy via on stress-induced voiding (SIV) in narrow-wide copper interconnect structure was analyzed by using three-dimensional finite element method. For wide M1 interconnect, structures of no dummy via, dummy via in the middle, dummy via in the edge of right side and double dummy vias were investigated, respectively. Simulation results showed that dummy via not only reduced void growth rate on via bottom of M1 interconnect, but also turned M1 interconnect under the dummy via into additional vacancy collector, thus effectively reducing SIV. It is concluded that double dummy vias could further enhance SIV performance.