稀土学报（英文版）
稀土學報（英文版）
희토학보（영문판）
JOURNAL OF RARE EARTHS
2004年
z2期
178-182
,共5页
strained Si%nano scale SiGe layer%Ge mole fraction%HVCVD%gas flow%boat-out time
The strained Si grown on the relaxed SiGe-on-insulator C-MOSFET's is a promising device for the future system LSI devices with the design rule of sub-micron. The achievement of the discrete Ge mole fraction in the SiGe layer is a key engineering in low-temperature SiGe epitaxial growth using HVCVD. The pre-flow of GeH4 gas enhanced the Ge mole fraction and SiGe layer thickness. In addition, the Ge mole fraction and SiGe layer thickness increases with the gas ratio of GeH4/SiH4 + GeH4, process temperature, and gas flow time. However, the haze was produced if the Ge mole fraction is above 22wt%. The discrete-like Ge mole fraction with 22 wt% in 10 nm SiGe layer was obtained by the pre-flow of GeH4 for 10 s, the mixture gas ratio of GeH4/SiH4 + GeH4 of 67%, and the gas flow time for 150 s at the process temperature of 550 C.
