CAJ | 학술논문

IC 3D集成需要穿透硅互连技术,也就是需要实现晶圆一侧到另一侧的电互连。很多穿透硅互连技术的应用需要在表面起伏很大的晶圆表面光刻图形,这就要先在晶圆表面均匀涂布光刻胶层。文章研究了光刻胶AZ4620的雾化喷涂性能,在沈阳芯源微电子设备有限公司KS-M200-1SP喷雾式涂胶机上进行了雾化喷涂试验,对光刻胶流量、扫描速度、热板温度等工艺参数进行了研究以找到适合硅通孔喷涂的工艺配方。对光刻胶雾化喷涂技术的难点做了探讨并提出加热吸盘的解决方案,找到了得到最佳覆盖性和表面粗糙度的热盘温度。
IC 3D집성수요천투규호련기술,야취시수요실현정원일측도령일측적전호련。흔다천투규호련기술적응용수요재표면기복흔대적정원표면광각도형,저취요선재정원표면균균도포광각효층。문장연구료광각효AZ4620적무화분도성능,재침양심원미전자설비유한공사KS-M200-1SP분무식도효궤상진행료무화분도시험,대광각효류량、소묘속도、열판온도등공예삼수진행료연구이조도괄합규통공분도적공예배방。대광각효무화분도기술적난점주료탐토병제출가열흡반적해결방안,조도료득도최가복개성화표면조조도적열반온도。
3D integration requires a through-Si interconnects, i.e. an integration of electrical connection from one side of the wafer to the other side. In many cases, it involves the lithographic patterning over high topography. For this step, a conformal coating of photoresist layer is necessary. In this paper, a spray coating process of AZ4620 resist has been investigated. The process is developed in KS-M200-1SP spray coating equipment of KINGSEMI Co.,Ltd. Parameters of the spray process such as dispense rate, scan speed and chuck temperature have been studied to find out proper process for the application of through-Si interconnects. Some limitations for patterning inside the vias are also discussed and hot chuck to overcome these limitations are proposed. Suitable temperature has been found out to obtain the best coverage and surface roughness.