电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2011年
5期
288-290
,共3页
低温共烧陶瓷%多芯片组件%耐焊性%附着力
低溫共燒陶瓷%多芯片組件%耐銲性%附著力
저온공소도자%다심편조건%내한성%부착력
Low temperature co-fired ceramics%MCM%Times of soldering%Adhesion
提出了一种新型的MCM-C/D微波基板研制方法,克服了低温LTCC基板微带线耐焊性差及附着力差的缺点。研究了MCM-C/D基板的膜层结构特征及制作过程的工艺控制方法,并给出相应的试验结果,这对于微波电路基板的设计和应用有一定的参考价值。
提齣瞭一種新型的MCM-C/D微波基闆研製方法,剋服瞭低溫LTCC基闆微帶線耐銲性差及附著力差的缺點。研究瞭MCM-C/D基闆的膜層結構特徵及製作過程的工藝控製方法,併給齣相應的試驗結果,這對于微波電路基闆的設計和應用有一定的參攷價值。
제출료일충신형적MCM-C/D미파기판연제방법,극복료저온LTCC기판미대선내한성차급부착력차적결점。연구료MCM-C/D기판적막층결구특정급제작과정적공예공제방법,병급출상응적시험결과,저대우미파전로기판적설계화응용유일정적삼고개치。
A new method of MCM-C/D in microwave circuits has been introduced.This method can overcome the disadvantages of microstrip on the LTCC substrate such as times of soldering and adhesion.The fabrication technologies and the method of control in the process in MCM-C/D substrate have been studied.The experimental results are given.It is of important referenced values for design and application of microwave circuits.
