CAJ | 학술논문

铁杂质是硅片制造过程中常见的重金属沾污，表面光电压(SPV)法可很好地用于测定P型硅中铁杂质。本文通过SPV法测试不同流程制造的P型抛光硅片中的铁沾污，找到了在P型抛光硅片制造工艺过程中引入铁沾污的主要来源。
철잡질시규편제조과정중상견적중금속첨오，표면광전압(SPV)법가흔호지용우측정P형규중철잡질。본문통과SPV법측시불동류정제조적P형포광규편중적철첨오，조도료재P형포광규편제조공예과정중인입철첨오적주요래원。
The impurity of iron is one major heavy-metal contamination on the silicon wafer. Surface photo-voltage method(SPV) can be used to accurately measure the iron contamination within the silicon wafer. In this work, the iron contamination on the polished silicon wafers fabricated by different procedures has been probed by SPV, and then the dominant iron contamination sources during the fabrication process have been found.