CAJ | 학술논문

利用电子束蒸镀实现了Ti/Ni/Au多层膜在CVD金刚石膜上的金属化,并研究了预处理和后处理工艺对多层膜在基底上结合的影响,发现高温预处理对多层膜和基底的结合有明显的改善.参照国标GJB 126-86进行了热循环试验,未发现多层膜从金刚石膜脱落.利用背散射谱研究了Ti/Ni/Au金属化体系在真空中分别加热400℃和500℃,60 min 金属层的热稳定性.结果发现:优化工艺金刚石膜和金属层间的良好结合和稳定性满足金刚石膜热沉应用的要求.
이용전자속증도실현료Ti/Ni/Au다층막재CVD금강석막상적금속화,병연구료예처리화후처리공예대다층막재기저상결합적영향,발현고온예처리대다층막화기저적결합유명현적개선.삼조국표GJB 126-86진행료열순배시험,미발현다층막종금강석막탈락.이용배산사보연구료Ti/Ni/Au금속화체계재진공중분별가열400℃화500℃,60 min 금속층적열은정성.결과발현:우화공예금강석막화금속층간적량호결합화은정성만족금강석막열침응용적요구.
Ti/Ni/Au multilayers have been deposited by electron beam evaporation, to metallize CVD diamond wafers. The effect of pre-treatment and post-treatment on adhesion of the multi-layers to the substrates was investigated, and it was found, introducing a pre-fire at elevated temperatures, the adhesion could be improved significantly. Thermal cycling experiments were accomplished according to the Chinese national standard (GJB 126-86), and the multi-layers were not peeled off from the diamond wafers. Rutherford back-scattering spectroscopy (RBS) had been used to characterize the stability of the Ti/Ni/Au metallization scheme at 400℃, 500℃ for 60 min in vacuum. In conclusion, the good adhesion and the stability of the optimized processing between the diamond and the metal-layers can meet the required of the diamond application as heat sink.