化工新型材料
化工新型材料
화공신형재료
NEW CHEMICAL MATERIALS
2009年
11期
55-57,60
,共4页
祝佳丽%吴淼%魏无际%黄健
祝佳麗%吳淼%魏無際%黃健
축가려%오묘%위무제%황건
等离子体聚合%马来酸酐%聚偏氟乙烯%亲水改性
等離子體聚閤%馬來痠酐%聚偏氟乙烯%親水改性
등리자체취합%마래산항%취편불을희%친수개성
plasma polymerization%maleic anhydride%PVDF%hydrophilicity modification
以马来酸酐(MAH)低温等离子体接枝聚合的方法对聚偏氟乙烯(PVDF)薄膜表面进行亲水改性.分析了袁面的MAH化学结构;考察了等离子体功率与表面聚合量和表面水接触角的关系;讨论了改性薄膜在热浓硫酸中长期作用的结果.结果表明:等离子体使MAH在表面双键打开并接枝聚合;聚合量随处理功率的增加呈先上升后下降的趋势,30W时最大;经过等离子体处理后,水接触角由97°下降至45°~70°,水解后降低至40°~55°,30W的改性膜表面水接触角最小;改性薄膜在热浓硫酸中作用1000h后,MAH聚合物没有被腐蚀掉,与未浸泡硫酸试样相比,水接触角变化不大.
以馬來痠酐(MAH)低溫等離子體接枝聚閤的方法對聚偏氟乙烯(PVDF)薄膜錶麵進行親水改性.分析瞭袁麵的MAH化學結構;攷察瞭等離子體功率與錶麵聚閤量和錶麵水接觸角的關繫;討論瞭改性薄膜在熱濃硫痠中長期作用的結果.結果錶明:等離子體使MAH在錶麵雙鍵打開併接枝聚閤;聚閤量隨處理功率的增加呈先上升後下降的趨勢,30W時最大;經過等離子體處理後,水接觸角由97°下降至45°~70°,水解後降低至40°~55°,30W的改性膜錶麵水接觸角最小;改性薄膜在熱濃硫痠中作用1000h後,MAH聚閤物沒有被腐蝕掉,與未浸泡硫痠試樣相比,水接觸角變化不大.
이마래산항(MAH)저온등리자체접지취합적방법대취편불을희(PVDF)박막표면진행친수개성.분석료원면적MAH화학결구;고찰료등리자체공솔여표면취합량화표면수접촉각적관계;토론료개성박막재열농류산중장기작용적결과.결과표명:등리자체사MAH재표면쌍건타개병접지취합;취합량수처리공솔적증가정선상승후하강적추세,30W시최대;경과등리자체처리후,수접촉각유97°하강지45°~70°,수해후강저지40°~55°,30W적개성막표면수접촉각최소;개성박막재열농류산중작용1000h후,MAH취합물몰유피부식도,여미침포류산시양상비,수접촉각변화불대.
PVDF film was surface modified by the low-temperature plasma polymerization technique with maleic an-hydride as the monomer. Surface chemical structure of modified film was investigated. Effect of plasma power on surface polymer amount and contact angles of the modified PVDF film was discussed. The change of modified film in heated sulfu-ric acid solution was researched. The result showed that MAH was found polymerizing with the double bond under plasma treatment, accompanied by ring-opening reaction of anhydride ring. As the plasma power increased, MAH polymer a-mount contented a trend of rise first then fall The polymer amount had a maximum under 30W. The surface contact angles of the modified films were decreased to 45°~70° after modified, then decreased again to 40°~55° after hydrolyzed. The contact angle of modified film had a minimum under 30W. After dipping in heated sulfuric acid solution 1000h, the MAH polymer wasn't corroded. The contact angle of modified film dipping in heated sulfuric acid solution had little compared with the one didn't dip in heatedsulfuric acid solution.