CAJ | 학술논문

采用脉冲电沉积工艺制备了铜沉积层,研究了电流密度、脉冲频率和占空比对铜镀层织构的影响.利用X射线衍射仪(XRD)和扫描电子显微镜(SEM)分析了铜镀层的织构和形貌.实验结果表明,低电流密度下为(200)晶面择优取向,高电流密度下为(111)晶面择优取向,频率越高则择优取向越强.低频脉冲下制备的沉积层平整致密.
채용맥충전침적공예제비료동침적층,연구료전류밀도、맥충빈솔화점공비대동도층직구적영향.이용X사선연사의(XRD)화소묘전자현미경(SEM)분석료동도층적직구화형모.실험결과표명,저전류밀도하위(200)정면택우취향,고전류밀도하위(111)정면택우취향,빈솔월고칙택우취향월강.저빈맥충하제비적침적층평정치밀.
The copper deposit was prepared by pulse electroplating process. The effects of current density, pulse frequency and duty cycle on the copper deposit texture were studied. The texture and morphology of copper deposit were analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM), respectively. The test results showed that the preferential orientation is (200) at lower current density and (111) at higher current density; the higher of the pulse frequency, the stronger is the preferential orientation. Smooth and compact copper deposit is obtained at low pulse frequency.