CAJ | 학술논문

Au-Sn(质量分数为20%)共晶焊料有着优良的导热和导电特性,已被广泛应用在光电子和微电子的器件封装工业中.对微氰和无氰电镀Au-Sn合金的两种电镀方法进行了研究,概述了镀液组分和电镀工艺条件,用扫描电镜的方法测试不同电流密度下Au-Sn合金组分,用测厚仪测试镀层厚度,计算出镀速,最终确定电镀Au-Sn(质量分数为20%)合金的电镀条件,并对微氰和无氰电镀液优缺点进行了对比分析.
Au-Sn(질량분수위20%)공정한료유착우량적도열화도전특성,이피엄범응용재광전자화미전자적기건봉장공업중.대미청화무청전도Au-Sn합금적량충전도방법진행료연구,개술료도액조분화전도공예조건,용소묘전경적방법측시불동전류밀도하Au-Sn합금조분,용측후의측시도층후도,계산출도속,최종학정전도Au-Sn(질량분수위20%)합금적전도조건,병대미청화무청전도액우결점진행료대비분석.
Au-Sn (20% ) eutectic solder has superior mechanical strength and thermal performance, so it is widely used in optoelectronics/electronics industry. Mcro-cyanide and non-cyanide electroplating solutions for Au-Sn alloy were developed, and the bath composition and plating conditions were overiviewed. The Sn content was tested in different current density by SEM (scanning electron microscope). Plating velocity was calculated by thickness of coating and time. The plating conditions of Au-Sn (20% ) were determined. And the comparative analysis of advantages and disadvantages was made for micro-cyanide and non-cyanide electroplating solution.