CAJ | 학술논문

对印制电路板(PCB)金手指表面变色进行研究,通过对铜原子扩散的分析,解释了PCB金手指表面变色的原因,即铜原子扩散到PCB金手指表面而被氧化;另外,通过分析铜原子在PCB金手指表面的扩散的内在驱动力,并利用菲克定律结合实际条件得出铜在PCB金手指表面的扩散流量和浓度分布表达式,为在实际运用中防止铜原子在PCB金手指表面的扩散提供了理论依据.
대인제전로판(PCB)금수지표면변색진행연구,통과대동원자확산적분석,해석료PCB금수지표면변색적원인,즉동원자확산도PCB금수지표면이피양화;령외,통과분석동원자재PCB금수지표면적확산적내재구동력,병이용비극정률결합실제조건득출동재PCB금수지표면적확산류량화농도분포표체식,위재실제운용중방지동원자재PCB금수지표면적확산제공료이론의거.
The phenomenon of printed circuit board (PCB) bonding finger surface discoloration was explained by analyzing the diffusion of copper atoms,that was, the copper atoms diffused from copper substrate to PCB bonding finger surface, then was oxidized. At the same time, the inherent driving force of copper atoms diffusion in the PCB bonding finger was analyzed. In addition, the diffusion flux and concentration distribution expressions of copper atoms in the PCB bonding finger were drawn by analyzing Fick's Law combined with actual conditions, which provided a theoretical basis for preventing diffusion of copper atoms in the PCB bonding finger.