电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2011年
8期
40-42
,共3页
针孔%镀层结合力%拉筋%绝缘测试
針孔%鍍層結閤力%拉觔%絕緣測試
침공%도층결합력%랍근%절연측시
pinhole%combine for plating%tendon pull%ISO test
文章分析了TO-220FS封装产品的内部特点,深入研究对比传统全包封产品内部结构特点情况,介绍产品的工艺流程和过程中出现的各种技术难点,通过原因分析并采取相应的措施,顺利地解决了这些问题。同时根据产品结构特点,在解决问题的同时给出了TO-220FS大批量生产时的工艺条件、工艺技术、改造设备的技术要点,攻克了塑封针孔、去料道、电镀镀层结合不良、剪切拉筋、绝缘测试等问题,顺利地实现了批量生产。装配后产品技术指示达到国际先进水平,产品质量稳定。
文章分析瞭TO-220FS封裝產品的內部特點,深入研究對比傳統全包封產品內部結構特點情況,介紹產品的工藝流程和過程中齣現的各種技術難點,通過原因分析併採取相應的措施,順利地解決瞭這些問題。同時根據產品結構特點,在解決問題的同時給齣瞭TO-220FS大批量生產時的工藝條件、工藝技術、改造設備的技術要點,攻剋瞭塑封針孔、去料道、電鍍鍍層結閤不良、剪切拉觔、絕緣測試等問題,順利地實現瞭批量生產。裝配後產品技術指示達到國際先進水平,產品質量穩定。
문장분석료TO-220FS봉장산품적내부특점,심입연구대비전통전포봉산품내부결구특점정황,개소산품적공예류정화과정중출현적각충기술난점,통과원인분석병채취상응적조시,순리지해결료저사문제。동시근거산품결구특점,재해결문제적동시급출료TO-220FS대비량생산시적공예조건、공예기술、개조설비적기술요점,공극료소봉침공、거료도、전도도층결합불량、전절랍근、절연측시등문제,순리지실현료비량생산。장배후산품기술지시체도국제선진수평,산품질량은정。
This document analyzes the TO-220FS packaged product internal features,in-depth study in comparing the traditional features of the internal structure of the whole encapsulation products.It introduces products and processes that occur to meet a variety of technical difficulty,and take appropriate measures to successfully address these problems by cause analysis.And according to product structure problem-solving at the same time,the document also gives the TO-220FS process conditions,technology,equipment renewal of the technical points in mass production,It solves the problem of the pinhole,deruner,less combine for plating,tendon pull in trimming process,isolation testing etc.,after reading this document and applying the technology,the mass production can be successfully realized,the assembly technology can be reached the international advanced level of technology,product quality is steady,and customer can be very satisfied.