CAJ | 학술논문

以液态双酚A环氧树脂为基料,苯酐为固化剂,咪唑类为促进剂,苄基缩水甘油醚为稀释荆,硅微粉为填料制得了性能优异的电器灌封材料.考察了硅微粉的种类及用量对环氧灌封材料的凝胶化时间、冲击强度、吸水率、体积电阻率的影响.结果表明活性硅微粉对提高环氧灌封材料的性能有利,当活性硅微粉用量为150质量份时,环氧灌封材料的综合性能较佳.
이액태쌍분A배양수지위기료,분항위고화제,미서류위촉진제,변기축수감유미위희석형,규미분위전료제득료성능우이적전기관봉재료.고찰료규미분적충류급용량대배양관봉재료적응효화시간、충격강도、흡수솔、체적전조솔적영향.결과표명활성규미분대제고배양관봉재료적성능유리,당활성규미분용량위150질량빈시,배양관봉재료적종합성능교가.
Epoxy encapsulateing materials with high property were prepared using epoxy as matrix.PA as curing agent,imidazole as accelerant,benzyl glycidol ether as thinner,silica powder as the filler.The influence of the kind and using level of silica powder on the gelation time,impact strength,water absorption and volume resistivety of the epoxy encapsulateing materials were studied.The experimental results indicated that the active silica powder played an important role in materiall's property,the combination property is better when the using level of active silica powder is 150 mass number.