CAJ | 학술논문

微细无铅焊料合金粉末易团聚和氧化,通过表面改性处理可提高其分散性及抗氧化性.本文以紧耦合气雾化法所制备的SnAgCu合金粉末为原料,采用真空蒸镀法对SnAgCu合金粉末进行包覆硬脂酸的改性研究,研究蒸镀温度、蒸镀时间等工艺条件对SnAgCu合金粉末改性效果的影响;采用扫描电镜(SEM)、透射电镜(TEM)对包覆后合金粉末的形貌及结构进行观测,采用X射线光电子能谱仪(XPS) 和碳硫联测仪分别对包覆后粉末的光电子能量和C含量进行测试.研究结果表明:合适的真空蒸镀条件是蒸镀温度70℃,蒸镀时间12h,真空度低于1.6×10~(-2)Pa,在此条件下可得到均匀致密、厚度为5～10nm的包覆层;硬脂酸包覆SnAgCu合金粉末遵循岛状生长机理,其包覆行为是物理吸附过程.
미세무연한료합금분말역단취화양화,통과표면개성처리가제고기분산성급항양화성.본문이긴우합기무화법소제비적SnAgCu합금분말위원료,채용진공증도법대SnAgCu합금분말진행포복경지산적개성연구,연구증도온도、증도시간등공예조건대SnAgCu합금분말개성효과적영향;채용소묘전경(SEM)、투사전경(TEM)대포복후합금분말적형모급결구진행관측,채용X사선광전자능보의(XPS) 화탄류련측의분별대포복후분말적광전자능량화C함량진행측시.연구결과표명:합괄적진공증도조건시증도온도70℃,증도시간12h,진공도저우1.6×10~(-2)Pa,재차조건하가득도균균치밀、후도위5～10nm적포복층;경지산포복SnAgCu합금분말준순도상생장궤리,기포복행위시물리흡부과정.
Fine leadless solder alloy powder is easy to be agglomeration and oxidization,whose dispersivity and antioxidation can be improved by surface modification technique.In this paper,the raw material is SnAgCu alloy powder which is produced by the method of close-coupled gas atomization.It was used that vacuum evaporation modify SnAgCu alloy powder by coating stearic acid.The influence of the vacuum evaporation temperature and time on modification effects of SnAgCu alloy powder were studied.Scanning Electricity Microscope (SEM) and transmission electricity microscope (TEM) were used to observe the appearance and structure of coating alloy powder and X-Ray photoelectron spectroscopy(XPS) and carbon-sulfur united testing instrument were adopted to measure photoelectron energy and test C contents of the coating powder.The result indicated that the appropriate conditions of vacuum evaporation were:70℃ for 12h and lower than 1.6×10~(-2)Pa vacuum degree.In this condition,uniform and compact coating,whose thickness was 5-10nm,could be obtained.The growth mechanism of stearic acid coating SnAgCu alloy powder was following volmer-weber,and the coating behavior was a process of physical adsorption.