印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2011年
8期
38-41
,共4页
OSP处理%OSP成膜机理%反应历程%顺序反应
OSP處理%OSP成膜機理%反應歷程%順序反應
OSP처리%OSP성막궤리%반응역정%순서반응
surface processing of OSP%OSP s mechanism which formed film%course of reaction%sequential reaction
对印制板表面处理作了简单的回顾,然后重点讲述OSP的反应机理,OSP产品的特点,OSP成膜过程以及乙酸和氨的初值对成膜的敏感依赖性和微蚀对成膜的影响,以及运用OSP成膜机理解决生产中出现的品质问题。近年来,OSP作为印制板表面处理的主流,有取代热风整平工艺及松香工艺的趋势,更适合电子工艺中SMT技术发展及环保方面的要求。
對印製闆錶麵處理作瞭簡單的迴顧,然後重點講述OSP的反應機理,OSP產品的特點,OSP成膜過程以及乙痠和氨的初值對成膜的敏感依賴性和微蝕對成膜的影響,以及運用OSP成膜機理解決生產中齣現的品質問題。近年來,OSP作為印製闆錶麵處理的主流,有取代熱風整平工藝及鬆香工藝的趨勢,更適閤電子工藝中SMT技術髮展及環保方麵的要求。
대인제판표면처리작료간단적회고,연후중점강술OSP적반응궤리,OSP산품적특점,OSP성막과정이급을산화안적초치대성막적민감의뢰성화미식대성막적영향,이급운용OSP성막궤리해결생산중출현적품질문제。근년래,OSP작위인제판표면처리적주류,유취대열풍정평공예급송향공예적추세,경괄합전자공예중SMT기술발전급배보방면적요구。
This text made a simple review to the PCB surface processing,the important reactive mechanics of OSP,the characteristics of OSP product,the course of OSP that formed film,acetic acid and ammonia water initial value sensitive dependence to formed film,micoetching to formed film,and exercising mechanism of the OSP which formed film to solve qualitative blemish during producing,In recent years,the OSP becomes the main PCB surface processing,it becomes trend to replace HASL techniques and rosin techniques,which is more suitable for the SMT technique in the electronic tech requirement of the development and environmental protection.
