CAJ | 학술논문

　　印制电路板（PCB）是绝大多数电子产品实现电子器件互联的基板。传统的印制板制造要用到化学镀铜等化学工艺。这些工艺中要用到一些对人体和环境有影响的化学品，同时要使用和排放大量的水，其中含有致癌物甲醛等各种化学物质，因而带来严重环境问题。为此，开发了替代这些对环境有严重污染的工艺的新技术，这就是印制板直接电镀技术。其关键是采用了导电聚合物来替代化学镀铜。
　　인제전로판（PCB）시절대다수전자산품실현전자기건호련적기판。전통적인제판제조요용도화학도동등화학공예。저사공예중요용도일사대인체화배경유영향적화학품，동시요사용화배방대량적수，기중함유치암물갑철등각충화학물질，인이대래엄중배경문제。위차，개발료체대저사대배경유엄중오염적공예적신기술，저취시인제판직접전도기술。기관건시채용료도전취합물래체대화학도동。
The printed circuit board (PCB) substrate is the vast majority of electronic products for electronic devices interconnected. Traditional PCB manufacturing is to do chemical process to use to chemical etching and electroless plating. Use these process with chemicals have the impact on the human body and the environment, at the same time you have to use and emit large quantities of water, which contains the carcinogen formaldehyde and other chemicals, which brought serious environmental problems. So the development of new technology to replace these serious environmental pollution processes, directly printed circuit board plating technology is developed. The key is to use conductive polymers instead of the electroless copper plating.