CAJ | 학술논문

主要研究95.5Sn3.8Ag0.7Cu焊球电迁移过程和焊点的失效行为,发现焊点的电迁移过程主要分为3个阶段：微孔洞的孕育与形成、孔洞的聚集和快速失效阶段。 Cu6 Sn5生长速率随着环境温度的升高而增大,Cu3 Sn在UBM和Cu6 Sn5的界面处也随着Cu6 Sn5的长大而生成并生长, PCB侧的Cu焊盘在电子风的作用下溶解。焊点的失效模式主要为焊盘的溶解、焊球两个界面的裂纹生长断裂和焊球的熔化。
주요연구95.5Sn3.8Ag0.7Cu한구전천이과정화한점적실효행위,발현한점적전천이과정주요분위3개계단：미공동적잉육여형성、공동적취집화쾌속실효계단。 Cu6 Sn5생장속솔수착배경온도적승고이증대,Cu3 Sn재UBM화Cu6 Sn5적계면처야수착Cu6 Sn5적장대이생성병생장, PCB측적Cu한반재전자풍적작용하용해。한점적실효모식주요위한반적용해、한구량개계면적렬문생장단렬화한구적용화。
The electromigration process and failure behaviors of 95.5 Sn3.8 Ag0.7 Cu solder bumps were in-vestigated. And it was found that the electromigration of bumps had three main stages:the incubation and formation of micro-hole,the assemblyof holesand therapid failure. Cu6 Sn5 grew faster with the elevated tem-perature. Cu3 Sn generated and grew at the interface between UBM and Cu6 Sn5 as Cu6 Sn5 grew. The copper pad dissolved under the electron wind at PCB side. The three failure models of solder bump were identified as the copper pad dissolution,the crack propagation at two sides of solder bumps’interface and the meltingof solder.