电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
7期
1-4,11
,共5页
环氧树脂%有机硅树脂%改性%封装材料
環氧樹脂%有機硅樹脂%改性%封裝材料
배양수지%유궤규수지%개성%봉장재료
epoxy resin%silicone resin%modify%packaging materials
文中通过合成超支化的聚苯基硅树脂体系,对环氧树脂进行改性,以提升其介电、耐湿、耐热和力学性能。研究表明,超支化聚苯基硅树脂体系(HBPSi)的加入量在0~10wt%时,改性后的树脂体系介电、耐湿、耐热和力学性能随着HBPSi增加而提升;而在大于10wt%时,其性能的提升减缓。产生这种结果主要归因于一方面HBPSi与EP中的羟基反应,消耗了环氧树脂体系的羟基,另一方面是引入了大量的柔性硅氧链节。
文中通過閤成超支化的聚苯基硅樹脂體繫,對環氧樹脂進行改性,以提升其介電、耐濕、耐熱和力學性能。研究錶明,超支化聚苯基硅樹脂體繫(HBPSi)的加入量在0~10wt%時,改性後的樹脂體繫介電、耐濕、耐熱和力學性能隨著HBPSi增加而提升;而在大于10wt%時,其性能的提升減緩。產生這種結果主要歸因于一方麵HBPSi與EP中的羥基反應,消耗瞭環氧樹脂體繫的羥基,另一方麵是引入瞭大量的柔性硅氧鏈節。
문중통과합성초지화적취분기규수지체계,대배양수지진행개성,이제승기개전、내습、내열화역학성능。연구표명,초지화취분기규수지체계(HBPSi)적가입량재0~10wt%시,개성후적수지체계개전、내습、내열화역학성능수착HBPSi증가이제승;이재대우10wt%시,기성능적제승감완。산생저충결과주요귀인우일방면HBPSi여EP중적간기반응,소모료배양수지체계적간기,령일방면시인입료대량적유성규양련절。
In this paper, a novel hyperbranched phenyl silicone resin(HBPSi)was prepared, which was used to modify Epoxy resin(EP). Tests results showed that when the contents of HBPSi were in the range of 0~10wt%, modified EP presents better properties as contents raise more;when the contents were more than 10wt%, properties of Epoxy resin increased slowly. This result is mainly attributed to the reaction of HBPSi and hydroxyl of EP, at the same time, Number of silicon-oxygen chains were grafted to the EP.