CAJ | 학술논문

无芯载板封装技术，因为其Z向高度需求低，在微型移动设备方面非常具有吸引力。为了充分表述无芯封装技术的高品质和多功能性，需要研究这项技术的几个特定方面，以了解其优缺点。设计制造了一款典型的无芯板BGA封装的样板，并表征了其电源特性和IO信号完整性。通过采用标准有芯BGA封装和无芯BGA封装，对比两种封装的性能。
무심재판봉장기술，인위기Z향고도수구저，재미형이동설비방면비상구유흡인력。위료충분표술무심봉장기술적고품질화다공능성，수요연구저항기술적궤개특정방면，이료해기우결점。설계제조료일관전형적무심판BGA봉장적양판，병표정료기전원특성화IO신호완정성。통과채용표준유심BGA봉장화무심BGA봉장，대비량충봉장적성능。
Coreless packaging is an attractive option to meet the low z-height requirements typically demanded in low-profile mobile devices. In order to deliver high quality, fully functional assembled coreless packages several aspects of this technology need to be studied to understand the benefits and the drawbacks. Towards realizing this goal, a prototype coreless BGA package for an existing product was designed, fabricated, and characterized for power delivery and IO signal integrity. A comparative study of performance was performed on a 45nm CPU in a coreless BGA package.