印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
11期
59-63
,共5页
多层线路板%层偏%压合
多層線路闆%層偏%壓閤
다층선로판%층편%압합
Multi-Layer PCB%Layer Misregistration%Lamination
实现各层间准确对位是多层线路板制作的最关键的环节之一，然而影响层间准确对位的因素有很多，如内层线路曝光对位偏差、PE冲孔精度、板材涨缩、压合偏位、钻孔等。本文简述影响层间准确对位的多种因素，重点讨论压合工序的层偏问题，尝试通过偏位板的缺陷模式分析，以快速准确定位层偏板缺陷原因，及改善措施。
實現各層間準確對位是多層線路闆製作的最關鍵的環節之一，然而影響層間準確對位的因素有很多，如內層線路曝光對位偏差、PE遲孔精度、闆材漲縮、壓閤偏位、鑽孔等。本文簡述影響層間準確對位的多種因素，重點討論壓閤工序的層偏問題，嘗試通過偏位闆的缺陷模式分析，以快速準確定位層偏闆缺陷原因，及改善措施。
실현각층간준학대위시다층선로판제작적최관건적배절지일，연이영향층간준학대위적인소유흔다，여내층선로폭광대위편차、PE충공정도、판재창축、압합편위、찬공등。본문간술영향층간준학대위적다충인소，중점토론압합공서적층편문제，상시통과편위판적결함모식분석，이쾌속준학정위층편판결함원인，급개선조시。
However, there are many affects factors affecting the accurate alignment between the layers, such as the exposure registration deviation sheet of the inner board, PE punching accuracy, plate sizing, lamination deviation, drilling etc. This paper first gave a brief overview of the affect factors, and then analyzed the defect of layer misregistration in laminated board. Moreover the mechanism and improvement measures of defects problem were discussed. The accurate alignment between layers is one of the most critical aspects in multi-layer PCB.
