印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
11期
47-53
,共7页
局部混压%混压深度%混压尺寸
跼部混壓%混壓深度%混壓呎吋
국부혼압%혼압심도%혼압척촌
Partial Hybrid%Hybrid Depth%Hybrid Dimension
随着当今PCB加工成本不断升高的背景下,局部混压板数量日渐增多,混压深度和混压尺寸也越来越大,而对其溢胶、对位和翘曲三个方面的控制是其制造过程中的关键要点。本文提出了不同混压深度和不同混压尺寸下的局部混压板在这三方面的改善措施,从而大幅提升局部混压板的可制造性。
隨著噹今PCB加工成本不斷升高的揹景下,跼部混壓闆數量日漸增多,混壓深度和混壓呎吋也越來越大,而對其溢膠、對位和翹麯三箇方麵的控製是其製造過程中的關鍵要點。本文提齣瞭不同混壓深度和不同混壓呎吋下的跼部混壓闆在這三方麵的改善措施,從而大幅提升跼部混壓闆的可製造性。
수착당금PCB가공성본불단승고적배경하,국부혼압판수량일점증다,혼압심도화혼압척촌야월래월대,이대기일효、대위화교곡삼개방면적공제시기제조과정중적관건요점。본문제출료불동혼압심도화불동혼압척촌하적국부혼압판재저삼방면적개선조시,종이대폭제승국부혼압판적가제조성。
With PCB process cost rises, partial hybrid board’s quantities is increasing. Hybrid depth and hybrid dimension is larger and larger. Resin preventing, registration and warp are the key points of the partial hybrid board manufacturing. This paper made advanced suggestions on the three aspects of different hybrid depth and dimension to largely improve the partial hybrid board manufacturing.