印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
11期
42-46
,共5页
板厚控制%工程设计%层压
闆厚控製%工程設計%層壓
판후공제%공정설계%층압
PCB Thickness Control%Engineering Design%Lamination
PCB板厚控制是一个系统且涉及面广的工程，本文运用统计分析以及理论计算相结合的方法，从PCB板厚工程设计、层压板厚控制以及其它工序对板厚的影响等方面入手，系统阐述了PCB板厚的一些控制要点，为PCB板厚控制提供理论依据。
PCB闆厚控製是一箇繫統且涉及麵廣的工程，本文運用統計分析以及理論計算相結閤的方法，從PCB闆厚工程設計、層壓闆厚控製以及其它工序對闆厚的影響等方麵入手，繫統闡述瞭PCB闆厚的一些控製要點，為PCB闆厚控製提供理論依據。
PCB판후공제시일개계통차섭급면엄적공정，본문운용통계분석이급이론계산상결합적방법，종PCB판후공정설계、층압판후공제이급기타공서대판후적영향등방면입수，계통천술료PCB판후적일사공제요점，위PCB판후공제제공이론의거。
The work of PCB thickness control is a systematic and covers a wide range project. In this paper, the influences of PCB engineering design, lamination as well as other processes related on the PCB thickness were investigated by using statistical analysis and calculation, and some key points were concluded systematically, which provided a theoretical basis of PCB thickness control.
