印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
11期
26-27,58
,共3页
阻焊桥%桥形参数%数学模型%风险评估
阻銲橋%橋形參數%數學模型%風險評估
조한교%교형삼수%수학모형%풍험평고
Solder Bridge%Solder Bridge Shape Parameters%Mathematical Model%Risk Assessment
文章主要探讨了阻焊桥能力量化表征方法,在正常生产条件下量化表征阻焊桥设计(桥长、桥宽)与阻焊桥能力的关系,建立数学模型。根据生产能力界定设计参数的合理范围,并可根据数学模型对生产订单的阻焊桥脱落缺陷进行风险评估,筛选出难度订单,给出工程设计及制程工艺优化方案思路。
文章主要探討瞭阻銲橋能力量化錶徵方法,在正常生產條件下量化錶徵阻銲橋設計(橋長、橋寬)與阻銲橋能力的關繫,建立數學模型。根據生產能力界定設計參數的閤理範圍,併可根據數學模型對生產訂單的阻銲橋脫落缺陷進行風險評估,篩選齣難度訂單,給齣工程設計及製程工藝優化方案思路。
문장주요탐토료조한교능역량화표정방법,재정상생산조건하양화표정조한교설계(교장、교관)여조한교능력적관계,건립수학모형。근거생산능력계정설계삼수적합리범위,병가근거수학모형대생산정단적조한교탈락결함진행풍험평고,사선출난도정단,급출공정설계급제정공예우화방안사로。
This paper studied the method for quantitative characterization of the solder bridge process capability, quantitative characterization of solder bridge design parameters (solder bridge length, width) and the process ability of solder bridge under production conditions, and built a mathematical model. It defined the acceptable range of design parameters according to the production capacity and the mathematical model for the production order of defect which drop the solder bridge in risk assessment, and screened out the difficulty order,proposed project design and process engineering optimum proposal.