CAJ | 학술논문

在电子封装领域，通过利用纳米颗粒尺寸效应带来的熔点降低，SnAgCu 合金体系有希望替代传统的但有毒的 SnPb 焊料体系。分别选用硼氢化钠和邻啡罗琳作为还原剂和表面活性剂，采用化学还原法制备出Sn3.0Ag0.5Cu (质量分数)合金纳米粒子。对合成的纳米颗粒形貌采用场发射扫描电镜(FE-SEM)进行表征。通过对扫描电镜数据的分析，可统计出纳米颗粒的尺寸分布。研究表明，所合成的纳米颗粒尺寸随着反应物浓度的增加而增大。通过理论分析，对反应物浓度在纳米颗粒尺寸控制中的作用进行了阐述。
재전자봉장영역，통과이용납미과립척촌효응대래적용점강저，SnAgCu 합금체계유희망체대전통적단유독적 SnPb 한료체계。분별선용붕경화납화린배라림작위환원제화표면활성제，채용화학환원법제비출Sn3.0Ag0.5Cu (질량분수)합금납미입자。대합성적납미과립형모채용장발사소묘전경(FE-SEM)진행표정。통과대소묘전경수거적분석，가통계출납미과립적척촌분포。연구표명，소합성적납미과립척촌수착반응물농도적증가이증대。통과이론분석，대반응물농도재납미과립척촌공제중적작용진행료천술。
Attributing to the melting temperature depressing resulted from the size effect of nanoparticles, the SnAgCu alloy system can be a promising candidate to replace the traditional toxic SnPb solder in the field of electronic packaging. Chemical reduction method was used to fabricate the Sn3.0Ag0.5Cu (SAC) (mass fraction, %) alloy nanoparticles. Sodium borohydride and 1,10-phenanthroline were chosen as the reducing agent and surfactant respectively. In addition, the morphology of the synthesized nanoparticles was investigated by field emission scanning electron microscopy (FE-SEM), and the size distribution of the as-prepared particles was obtained from the image analysis. It was found that the particle size increased with increasing the reactant concentration. Finally, theoretical analysis was employed to illustrate the influence of reactant concentration on the particle size.