CAJ | 학술논문

介绍了CQFN封装结构特点，指出了CQFN制造加工中热沉和外焊盘设计和加工是关键因素，需要进行特别的过程控制，并对加工中存在的热沉底部与陶瓷底面共面性控制、外焊盘电连接方式不同引起的相关可靠性问题进行了说明。对CQFN封装器件在板级组装过程中存在的热应力、桥连等可靠性问题进行了分析，指出了CQFN外壳组装后的焊点检测困难和器件失效后的返工困难问题。CQFN封装具有良好的电特性和热特性、体积小、重量轻等优势，其应用呈快速增长趋势，文章为高速高频器件CQFN封装提供了参考。
개소료CQFN봉장결구특점，지출료CQFN제조가공중열침화외한반설계화가공시관건인소，수요진행특별적과정공제，병대가공중존재적열침저부여도자저면공면성공제、외한반전련접방식불동인기적상관가고성문제진행료설명。대CQFN봉장기건재판급조장과정중존재적열응력、교련등가고성문제진행료분석，지출료CQFN외각조장후적한점검측곤난화기건실효후적반공곤난문제。CQFN봉장구유량호적전특성화열특성、체적소、중량경등우세，기응용정쾌속증장추세，문장위고속고빈기건CQFN봉장제공료삼고。
The structure of CQFN package is introduced. Point out the assembly defects of CQFN component, such as coplanarity control of the bottom planes of heatsink and package, the reliability caused by the different electrical connections of solder pads. Analyze the reliability of CQFN package caused by thermal stresses, solder-join and so on. Point out difficulty of solder check and repair. CQFN package provides with favorable electrical and thermal performance, small size, light weight .The application of CQFN package increase quickly, supply references to the application of CQFN package for high speed and high frequency devices.