CAJ | 학술논문

磷随着平板电脑、智能手机等消费类电子产品的飞速发展，印制电路HDI板逐渐由一阶向二阶、三阶和多阶等方向发展。任意层HDI作为高阶互连技术的最高境界，其应用已越来越受到追捧。以一种10层任意层HDI板为例，讲述该类板的制作难点及解决方法，重点突出了其制作的控制要点，为同行业生产该类产品提供一定的参考价值。
린수착평판전뇌、지능수궤등소비류전자산품적비속발전，인제전로HDI판축점유일계향이계、삼계화다계등방향발전。임의층HDI작위고계호련기술적최고경계，기응용이월래월수도추봉。이일충10층임의층HDI판위례，강술해류판적제작난점급해결방법，중점돌출료기제작적공제요점，위동행업생산해류산품제공일정적삼고개치。
With the development of tablet computer, intelligent mobile phone and other consumer electronics products, HDI board's blind via is developing from one step to two steps, three steps and multi steps. Any-layer HDI technology is the highest of the multi steps interconnect technology, it's becoming more and more popular. Tacking a 10-layer Any-layer HDI board as the model to describe the difficulties and solutions of production. Highlight production difficulties control points, guidance to improve the technique in the production of any-layer HDI.