CAJ | 학술논문

微波电路板与微波底板的焊透率是影响微波组件性能的重要因素，工装材料是影响焊透率的重要因素。分别用不锈钢和铝合金材料的工装进行微波电路大面积焊接试验，探讨工装材料对试样焊透率的影响。试验结果表明，铝合金工装平均焊透率高于不锈钢工装，并且焊透率一致性好，空洞较小，更适合作为微波电路接地焊的工装材料。
미파전로판여미파저판적한투솔시영향미파조건성능적중요인소，공장재료시영향한투솔적중요인소。분별용불수강화려합금재료적공장진행미파전로대면적한접시험，탐토공장재료대시양한투솔적영향。시험결과표명，려합금공장평균한투솔고우불수강공장，병차한투솔일치성호，공동교소，경괄합작위미파전로접지한적공장재료。
Soldering area ratio between microwave printed circuit board and substrate has important effect on performance of microwave modules which play key role in phased array radar. Fixture has important effect on soldering area ratio. Stainless steel fixture and aluminum fixture were used for large area soldering for microwave power circuits respectively. Soldering area percentage of the solder joints was studied. Results indicated samples soldered with aluminum fixture had smaller voids and showed better consistency than that with stainless steel fixture. So aluminum fixture is more suitable for large area soldering of microwave circuits than stainless steel fixture because aluminum alloy has lower thermal capacity, large thermal conductivity and better mechanical properties.