CAJ | 학술논문

针对电装行业的相关工艺规范要求，为避免“金脆”现象的发生，元器件引线的镀金层在焊接前应予以去除。简要分析了金脆现象产生的机理，探讨了高可靠性应用场合去金的必要性，并结合工作实际介绍了几种实用的去金工艺方法。
침대전장행업적상관공예규범요구，위피면“금취”현상적발생，원기건인선적도금층재한접전응여이거제。간요분석료금취현상산생적궤리，탐토료고가고성응용장합거금적필요성，병결합공작실제개소료궤충실용적거금공예방법。
The gold-plated layer of the component leads should be removed before soldering in order to avoid the occurrence of the phenomenon of golden crisp according to the process specification requirements of the electronics assembly industry. Analyze the mechanism of the gold brittle phenomenon, explore the necessity of degolding for the aerospace, military and high-reliability products, and describe several tinned method of degolding combined with the practical work.