化工进展
化工進展
화공진전
CHEMICAL INDUSTRY AND ENGINEERING PROGRESS
2013年
10期
2459-2462
,共4页
唑烷酮%环氧树脂%高强高韧
唑烷酮%環氧樹脂%高彊高韌
서완동%배양수지%고강고인
oxazolidone%epoxy resin%high strength and toughness
采用4,4-二苯基甲烷二异氰酸酯(MDI)对双酚A环氧树脂和脂肪族环氧树脂进行唑烷酮化共改性,研究了MDI及作为活性稀释剂的脂肪族环氧用量对改性产物黏度及树脂固化物力学性能、耐热性的影响。结果表明,低改性比和稀释剂可以有效降低唑烷酮改性环氧树脂黏度,当改性比为4∶1时,树脂固化物拉伸强度、弯曲强度达到75.4 MPa和158.2 MPa,分别比环氧树脂固化物提高了64%和57%,断裂延伸率和冲击强度有较大提高,具有高强高韧的特点。稀释剂含量对Tg影响较小,各改性树脂Tg在108~118℃之间,与纯环氧树脂的耐热性相当。
採用4,4-二苯基甲烷二異氰痠酯(MDI)對雙酚A環氧樹脂和脂肪族環氧樹脂進行唑烷酮化共改性,研究瞭MDI及作為活性稀釋劑的脂肪族環氧用量對改性產物黏度及樹脂固化物力學性能、耐熱性的影響。結果錶明,低改性比和稀釋劑可以有效降低唑烷酮改性環氧樹脂黏度,噹改性比為4∶1時,樹脂固化物拉伸彊度、彎麯彊度達到75.4 MPa和158.2 MPa,分彆比環氧樹脂固化物提高瞭64%和57%,斷裂延伸率和遲擊彊度有較大提高,具有高彊高韌的特點。稀釋劑含量對Tg影響較小,各改性樹脂Tg在108~118℃之間,與純環氧樹脂的耐熱性相噹。
채용4,4-이분기갑완이이청산지(MDI)대쌍분A배양수지화지방족배양수지진행서완동화공개성,연구료MDI급작위활성희석제적지방족배양용량대개성산물점도급수지고화물역학성능、내열성적영향。결과표명,저개성비화희석제가이유효강저서완동개성배양수지점도,당개성비위4∶1시,수지고화물랍신강도、만곡강도체도75.4 MPa화158.2 MPa,분별비배양수지고화물제고료64%화57%,단렬연신솔화충격강도유교대제고,구유고강고인적특점。희석제함량대Tg영향교소,각개성수지Tg재108~118℃지간,여순배양수지적내열성상당。
Oxazolidone ring was introduced into epoxy resin by reacting 4,4’-diphenylmethane diisocyanate (MDI) with epoxy resin composed of bisphenol A epoxy resin and aliphatic epoxy resin. The viscosity of modified epoxy resin,mechanical and thermal properties of cured resin were studied by changing the content of aliphatic epoxy resin which was used as reactive diluent and MDI. The viscosity of oxazolidone modified epoxy resin could be reduced effectively when modification ratio was decreased and content of diluent was increased. When modification ratio was 4∶1,tensile strength and bending strength of cured resin reached 75.4 MPa and 158.2 MPa. The values were increased by 64%and 57%respectively compared with those of bisphenol A epoxy resin cured samples. Elongation and impact strength were also greatly improved. Oxazolidone modified epoxy resin exhibited high strength and toughness. Diluent content indicated a small influence on glass transition temperature (Tg). The Tg of oxazolidone modified epoxy resin was between 108 ℃ and 118 ℃. Oxazolidone modified epoxy resin possessed thermal resistance as bisphenol A epoxy resin.