CAJ | 학술논문

利用循环伏安法和电化学交流阻抗谱研究了MBDA/Au，MBTA/Au，TBDA/Au，TBTA/Au修饰电极以及MBDA与DT混合自组装/Au、TBTA与DT混合自组装/Au修饰电极的覆盖度。结果表明这些自组装膜在金电极表面的覆盖度均比较高，达到99％以上；对同一类修饰电极，混合自组装膜的覆盖度高于单组分自组装膜的覆盖度，混合自组装体系的覆盖度随着DT比例的增加而增加；同类物质，长链化合物在金表面的覆盖度大于短链化合物，含二硫键的化合物与金电极的键合能力比含一个巯基的化合物键合能力强。
이용순배복안법화전화학교류조항보연구료MBDA/Au，MBTA/Au，TBDA/Au，TBTA/Au수식전겁이급MBDA여DT혼합자조장/Au、TBTA여DT혼합자조장/Au수식전겁적복개도。결과표명저사자조장막재금전겁표면적복개도균비교고，체도99％이상；대동일류수식전겁，혼합자조장막적복개도고우단조분자조장막적복개도，혼합자조장체계적복개도수착DT비례적증가이증가；동류물질，장련화합물재금표면적복개도대우단련화합물，함이류건적화합물여금전겁적건합능력비함일개구기적화합물건합능력강。
The electrochemical cyclic voltammetry and electrochemical impendence spectra were employed to characterize the cover -age of the pure SAMs of MBDA/Au,MBTA/Au,TBDA/Au and TBTA/Au.Meanwhile,using 11.11′-diundecanolthiol(DT)as the medium molecule ,the mixed SAMs of MBDA/DT and TBTA/DT on gold were also fabricated .The results showed that closely packed and well ordered SAMs had been fabricated and their surface coverages were over 99%.Mixed SAMs had higher coverages than the corresponding pure SAMs ,and the coverage increases with the increase of the molar ratio of the medium molecule DT .At the same time,with the lengthening of the ether linkage between thioctic acid or 11-mercaptoundecanoic acid and biotin ,the SAMs would have a greater surface coverage .