印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
9期
20-23
,共4页
介电常数(Dk)%介质损耗角正切(Df)%表面电阻
介電常數(Dk)%介質損耗角正切(Df)%錶麵電阻
개전상수(Dk)%개질손모각정절(Df)%표면전조
Dielectric Constant%Dissipation Factor%Surface Resistivity
Polyphenylene（聚酰亚胺）树脂带有非常好的介电性能，通过对Polyphenylene分子细量化，然后和带有好架桥性能以及可溶混性的树脂搅拌，开发出了同时带有低诱电（Low-Dk）和高耐热性，适用于高速信号传输设备使用的多层线路板材料。这个材料性能为Dk=3.8, Df=0.005(1 GHz), Tg=210℃。在5 GHz的使用条件下，与传统的材料相比，降低信号损失约15 db/m。可以广泛的应用在如网络设备等的高速，大容量信号传输设备。
Polyphenylene（聚酰亞胺）樹脂帶有非常好的介電性能，通過對Polyphenylene分子細量化，然後和帶有好架橋性能以及可溶混性的樹脂攪拌，開髮齣瞭同時帶有低誘電（Low-Dk）和高耐熱性，適用于高速信號傳輸設備使用的多層線路闆材料。這箇材料性能為Dk=3.8, Df=0.005(1 GHz), Tg=210℃。在5 GHz的使用條件下，與傳統的材料相比，降低信號損失約15 db/m。可以廣汎的應用在如網絡設備等的高速，大容量信號傳輸設備。
Polyphenylene（취선아알）수지대유비상호적개전성능，통과대Polyphenylene분자세양화，연후화대유호가교성능이급가용혼성적수지교반，개발출료동시대유저유전（Low-Dk）화고내열성，괄용우고속신호전수설비사용적다층선로판재료。저개재료성능위Dk=3.8, Df=0.005(1 GHz), Tg=210℃。재5 GHz적사용조건하，여전통적재료상비，강저신호손실약15 db/m。가이엄범적응용재여망락설비등적고속，대용량신호전수설비。
In the multilayer printed wiring board material used for high-speed transmission equipment, high-frequency capable material with low dielectric properties and high heat-resistance has been developed by reducing the molecular weight of polyphenylene ether resin, which has excellent dielectric properties, and blending it with a cross-linking agent having high miscibility with the resin. This material presents the characteristics of dielectric constant 3.8, dielectric loss tangent 0.005(1 GHz), glass transition temperature 210℃, and capable of reducing the transmission loss of a printed wiring board by approx 15db/m at 5 GHz compared with the conventional material, thereby enabling wide applications in high-end electronic equipment such as network equipment requiring high-speed and large-capacity transmission.
