电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2013年
8期
4-7
,共4页
铜-铬合金%电沉积%配位剂%氨基乙酸%电化学%导电性
銅-鉻閤金%電沉積%配位劑%氨基乙痠%電化學%導電性
동-락합금%전침적%배위제%안기을산%전화학%도전성
copper-chromium alloy%electrodeposition%complexing agent%glycine%electrochemistry%conductivity
采用氨基乙酸、抗坏血酸、硫脲和柠檬酸三钠4种配位体系镀液电沉积制备Cu-Cr合金。通过测定循环伏安曲线和线性扫描伏安曲线，研究了不同镀液的电化学行为。氨基乙酸体系镀液最适用于制备Cu-Cr合金，采用该配方制得的Cu-Cr合金中Cr含量高达18.63%，10 A/dm2下电镀10 min所得镀层厚度为25μm，表面平整，呈光亮的金黄色，结合力好，相对导电率达68.2%，导电性基本满足触头材料要求。
採用氨基乙痠、抗壞血痠、硫脲和檸檬痠三鈉4種配位體繫鍍液電沉積製備Cu-Cr閤金。通過測定循環伏安麯線和線性掃描伏安麯線，研究瞭不同鍍液的電化學行為。氨基乙痠體繫鍍液最適用于製備Cu-Cr閤金，採用該配方製得的Cu-Cr閤金中Cr含量高達18.63%，10 A/dm2下電鍍10 min所得鍍層厚度為25μm，錶麵平整，呈光亮的金黃色，結閤力好，相對導電率達68.2%，導電性基本滿足觸頭材料要求。
채용안기을산、항배혈산、류뇨화저몽산삼납4충배위체계도액전침적제비Cu-Cr합금。통과측정순배복안곡선화선성소묘복안곡선，연구료불동도액적전화학행위。안기을산체계도액최괄용우제비Cu-Cr합금，채용해배방제득적Cu-Cr합금중Cr함량고체18.63%，10 A/dm2하전도10 min소득도층후도위25μm，표면평정，정광량적금황색，결합력호，상대도전솔체68.2%，도전성기본만족촉두재료요구。
Cu-Cr alloy was prepared by electrodeposition respectively from 4 kinds of electrolytes containing different complexing agents i.e. glycine, ascorbic acid, thiourea, and trisodium citrate. The electrochemical behaviors of different electrolytes were studied by cyclic voltammetry and linear scanning voltammetry. The electrolyte with glycine as complexing agent is most suitable for electrodeposition of Cu-Cr alloy. The Cu-Cr alloy coating obtained therefrom at 10 A/dm2 for 10 min features Cr content up to 18.63%, thickness 25μm, smooth and bright golden yellow surface, strong adhesion, and relative conductivity 68.2%. The conductivity of the Cu-Cr alloy coating basically meets the demand of contact materials.
