CAJ | 학술논문

随着电子芯片热流密度的急剧增加及有效散热空间的日益狭小，具有高热导率、高可靠性、快热响应、无需额外动力等特点的扁平热管已成为电子领域使用的理想导热元件。提出了沟槽烧结吸液芯扁平热管的加热相变压扁制造方法；理论分析了加热相变压扁制造过程中热管几何形状变化和热管弹塑性大变形的成形过程，并进行了实验测试。结果发现：相变压扁过程作用机制为热管内部的饱和蒸汽压方程；相变压扁过程中，热管几何形状变化很大，最大等效塑性应变主要发生在扁平段吸液芯/蒸汽界面上；当压扁温度为480 K时，压扁热管的屈曲率微小，可忽略不计；相变压扁力随着压扁温度的升高和压扁位移的增大而增大。
수착전자심편열류밀도적급극증가급유효산열공간적일익협소，구유고열도솔、고가고성、쾌열향응、무수액외동력등특점적편평열관이성위전자영역사용적이상도열원건。제출료구조소결흡액심편평열관적가열상변압편제조방법；이론분석료가열상변압편제조과정중열관궤하형상변화화열관탄소성대변형적성형과정，병진행료실험측시。결과발현：상변압편과정작용궤제위열관내부적포화증기압방정；상변압편과정중，열관궤하형상변화흔대，최대등효소성응변주요발생재편평단흡액심/증기계면상；당압편온도위480 K시，압편열관적굴곡솔미소，가홀략불계；상변압편력수착압편온도적승고화압편위이적증대이증대。
With the rapid rising of heat flux and reduction of heat dissipating space of microelectronic devises, flattened sintered heat pipe has become an ideal conducting element of use in the electronic cooling field. A manufacturing technology named phase change flattening process is presented to fabricate the flattened grooved-sintered wick heat pipe (GSHP for short). Deformation geometry of flattened GSHP and the elasto-plastic deformation of flattening process are analyzed theoretically and verified by experiments. The results show that the vapor pressure inside sintered heat pipe during flattening process is determined by the saturated vapor pressure equation;the width and vapor area of flattened heat pipe change greatly as the flattening proceeds;the maximum equivalent strain distributes at the interface between wick and vapor in the flat section;the buckling phenomenon can be well eliminated when the flattening temperature reaches 480 K;phase change flattening punch load increases with flattening temperature and displacement.