CAJ | 학술논문

将复合缓蚀剂（苯并三氮唑（BTAH）和十二烷基磺酸钠（SDS））应用到铜的化学机械抛光液中，考察BTAH和SDS对铜表面化学机械抛光的影响，并探讨BTAH和SDS在铜表面的作用机制；分析BTAH和SDS抛光液中络合剂和表面活性剂对铜化学机械抛光性能的影响。结果表明：BTAH和SDS在铜表面形成了致密的Cu-BTAH和Cu-SDS保护膜，是优良的铜缓蚀剂。当以磷酸氢二胺（AHP）为络合剂，羟乙基纤维素（HEC）为表面活性剂时，优化后的BTAH和SDS抛光液取得了低至Ra0.2 nm的表面粗糙度，同时发现HEC有降低纳米颗粒残留的作用。
장복합완식제（분병삼담서（BTAH）화십이완기광산납（SDS））응용도동적화학궤계포광액중，고찰BTAH화SDS대동표면화학궤계포광적영향，병탐토BTAH화SDS재동표면적작용궤제；분석BTAH화SDS포광액중락합제화표면활성제대동화학궤계포광성능적영향。결과표명：BTAH화SDS재동표면형성료치밀적Cu-BTAH화Cu-SDS보호막，시우량적동완식제。당이린산경이알（AHP）위락합제，간을기섬유소（HEC）위표면활성제시，우화후적BTAH화SDS포광액취득료저지Ra0.2 nm적표면조조도，동시발현HEC유강저납미과립잔류적작용。
Mixed corrosion inhibitors(benzotriazole(BTAH)and sodium dodecyl sulfate(SDS))were utilized in copper chemical mechanical polishing(CMP)slurry.The influences of BTAH and SDS,complexing agent,and surfactant on the CMP of copper were studied,and the mechanisms of BTAH and SDS on copper surface were discussed.The results show that compact Cu-BTAH and Cu-SDS protective films are formed on the copper surface,and thus,which are excellent copper corrosion inhibitors.When using BTAH and SDS as mixed corrosion inhibitors,ammonium phosphate(AHP)as complexing agent,and hydroxy ethyl cellulose(HEC)as surfactant,a low surface roughness of 0.2 nm is got by this CMP slurry.The appearance of HEC in the slurry is found to be very effective in reducing the nano-sized particle deposition on copper surface.