CAJ | 학술논문

随着陶瓷球栅阵列（CBGA）封装形式的产品被广泛应用，空洞对可靠性的影响受到重视。以CBGA256封装形式的电路产品为例，通过调节回流温度曲线研究空洞形成的机理和回流焊时间对空洞率的影响。研究结果表明，随着加热时间的增加，焊点空洞的数量呈现先降低后升高的趋势，而加热时间过长不利于助焊剂残留的排出造成空洞增多，而回流时间的增加有利于回流过程中熔化焊料内部空洞的溢出。
수착도자구책진렬（CBGA）봉장형식적산품피엄범응용，공동대가고성적영향수도중시。이CBGA256봉장형식적전로산품위례，통과조절회류온도곡선연구공동형성적궤리화회류한시간대공동솔적영향。연구결과표명，수착가열시간적증가，한점공동적수량정현선강저후승고적추세，이가열시간과장불리우조한제잔류적배출조성공동증다，이회류시간적증가유리우회류과정중용화한료내부공동적일출。
With the widely used of ceramic ball grid array packaging products, the influence of void on the reliability of CBGA is a focus of concern. The paper took CBGA256 circuit products for examples, to study the formation mechanism of void and the inlfuence of relfow time on void ratio by adjusting relfow temperature proifle. The results show that the voids increased ifrstly and decreased subsequently with the heat time increasing, but voids increased signiifcantly because of the lfux residue if the heat time was too long. On the other hand, the exhaust of void in solder joint was promoted by increasing relfow time.